Transparent conductive films are core optoelectronic materials featuring high visible‑light transmittance and excellent electrical conductivity. The R&D focuses on addressing the industry bottleneck of mutual restriction between light transmittance and electrical conductivity, and carries out development work in four major dimensions: material formulation, film‑layer structure, preparation process and reliability.
Main R&D Directions
1.Material System Development
Optimize oxide formulations including ITO, AZO and FTO, and conduct research on low‑indium and indium‑free alternative materials; develop dielectric‑metal‑dielectric multilayer composite films and flexible conductive films to achieve both low sheet resistance and high light transmittance.
2.Film‑Layer Structure Design
Reduce interface reflection by means of optical simulation for multilayer films combined with anti‑reflection structures. Implement surface texturing to realize light‑trapping effect for applications in photovoltaic devices and optical window components.
3.Preparation Process R&D
Optimize process parameters such as magnetron sputtering and evaporation to control film thickness uniformity and grain morphology; improve the consistency of large‑area film formation to meet mass‑production requirements; develop low‑temperature film‑forming technology for flexible substrates.
4.Performance and Reliability R&D
Test sheet resistance, light transmittance, haze, thermal stability, temperature‑humidity resistance and cross‑hatch adhesion. Solve the problems of film peeling and resistance drift under high‑temperature and humid environments to adapt to harsh working conditions in industrial, automotive and medical scenarios.
Downstream Applicable Products
ITO electric‑heating glass, thin‑film solar cells, optical observation windows, touch‑control devices, smart dimming glass, defogging windows for instruments.
R&D Deliverables
Customized development can be completed according to customer specifications, delivering samples and photoelectric test reports, and supporting OEM/ODM for mass‑production implementation.
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