ITO Conductive Film Bus Electrode and Fabrication Method Thereof:
Fullchance Transparent Electric Heating Film: The invention discloses an ITO conductive film bus electrode and a fabrication method thereof. A metal layer is deposited on the surface of the ITO conductive film; photoresist is coated on the metal layer; a mask plate is laid flat on the surface of the photoresist, and ultraviolet light is applied to cure the photoresist to form a photoresist layer; developer solution is used to remove the uncured photoresist; etchant is adopted to etch away the metal layer and ITO conductive film not covered by the photoresist layer to retain the electrode pattern; the ITO conductive film is placed in stripping solution to remove the cured photoresist layer; the ITO conductive film is immersed in an anti‑oxidation solution to form a protective layer; a flexible printed circuit board is bonded to the ITO conductive film with the fabricated electrode pattern, so as to complete the fabrication of the bus electrode. The present invention is adaptable to various line widths and line spacings with strong adaptability. The metal deposition process enables reliable contact between the bus electrode and the ITO conductive film for high reliability. It also reduces processing procedures, shortens the processing cycle and lowers manufacturing costs. The metal layer mitigates scratching of ITO during processing of the ITO conductive film, which greatly improves the yield rate.
Fullchance ITO Transparent Electric Heating Film:
The utility model discloses an ITO conductive film bus electrode, which consists of a substrate, an ITO conductive film, a metal layer, a protective layer and a flexible printed circuit board. The ITO conductive film and the metal layer are sequentially sputter‑deposited on the substrate by vacuum sputter coating. The ITO conductive film and the metal layer are subjected to exposure, development and etching to form an electrode pattern. Anti‑oxidation treatment is performed on the surface of the electrode pattern to form a protective layer. The flexible printed circuit board is provided with standard interfaces and is bonded to the ITO conductive film with the fabricated electrode pattern. Compared with the prior art, the utility model is adaptable to various line widths and line spacings with strong adaptability. The metal deposition process achieves reliable contact between the bus electrode and the ITO conductive film for high reliability. The metal deposition process cuts down processing procedures, shortens the processing cycle and reduces manufacturing costs. The metal layer reduces ITO scratching during processing of the ITO conductive film and substantially boosts the yield rate.
The utility model discloses an ITO conductive film bus electrode, which consists of a substrate, an ITO conductive film, a metal layer, a protective layer and a flexible printed circuit board. The ITO conductive film and the metal layer are sequentially sputter‑deposited on the substrate by vacuum sputter coating. The ITO conductive film and the metal layer are subjected to exposure, development and etching to form an electrode pattern. Anti‑oxidation treatment is performed on the surface of the electrode pattern to form a protective layer. The flexible printed circuit board is provided with standard interfaces and is bonded to the ITO conductive film with the fabricated electrode pattern. Compared with the prior art, the utility model is adaptable to various line widths and line spacings with strong adaptability. The metal deposition process achieves reliable contact between the bus electrode and the ITO conductive film for high reliability. The metal deposition process cuts down processing procedures, shortens the processing cycle and reduces manufacturing costs. The metal layer reduces ITO scratching during processing of the ITO conductive film and substantially boosts the yield rate.
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