thermal equipment for a wide range of wafer processing applications.
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Fullchance Industrial Co.,limitedcomponents are central to the most advanced wafer processing methods in the semiconductor industry. Our new product development team contributes to the advancement of cutting‑edge front‑end technologies, and the Sainberlin manufacturing centre boasts robust capabilities for high‑volume production for top‑tier OEMs.
• Chuck Heaters:Fullchance designs and manufactures custom‑engineered high‑uniformity chucks for a wide range of processes, including CMP, photolithography, ashing/stripping, deposition, ion implantation, and more.
• Specialized Thermal Elements: Our new product development team is renowned for innovations in chamber ring heaters, valve heaters, showerheads, and other specialized components. Leveraging state‑of‑the‑art thermal modelling technologies and a large in‑house R&D laboratory, we deliver exceptional capabilities in this field.
• Standard Platens: 200 mm and 300 mm heated platens are available as standard products.
• High‑Purity Gas Heaters: Fullchance's PUR‑Therm gas delivery heaters supply gas for high‑purity heating chambers.
• Wet Bench Circulation Heaters: Our PUR‑X and Fullchance T‑X circulation heater series are compatible with heating applications for solvents, deionized water, and non‑critical gases.
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Fullchance Industrial Co.,limited is a leader in designing and manufacturing high‑performance base heaters. Excellence is our goal at every step, from
requirement analysis and initial design,
through iterative thermal and structural modeling, prototyping and testing, to the transition to mass production.
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• Our casting‑in method delivers extended heater service life and unparalleled thermal uniformity. Vacuum brazing and Interference Fit Construction (IFC) methods serve as excellent non‑casting alternatives.
• Aluminum 356 is the primary casting alloy for base heaters. It offers outstanding compatibility with most process environments, a maximum operating temperature of 450°C (840°F), and typical temperature uniformity of ±0.3% or better.
• With IFC, Aluminum 6061 can be utilized. For higher operating temperatures, Saint‑Bérain provides solutions featuring various stainless‑steel grades, copper, nickel, and other high‑performance alloys.
• Precision CNC machining produces components that meet stringent flatness requirements. Surface features such as wafer lift holes, proximity pins, and arrays of vacuum grooves are also available.
• Shafts are integrated via TIG or electron‑beam welding, followed by helium leak testing to guarantee vacuum integrity.
• Coating options include hard‑coat anodization, electroless nickel plating, gold plating, copper plating, powder coating options, micro‑grinding, and more. Passivation procedures may also be applied.
• Our in‑house cleanroom facility enables cleaning and packaging to meet semiconductor‑industry specifications.
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Compared with competing technologies, cast‑in heaters offer multiple performance advantages. Featuring a cast‑in design, the heating elements maintain close contact with the metal substrate, delivering uniform heat transfer and a longer overall service life, which reduces the total cost of ownership. |
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Engineers at Fullchance use Finite Element Analysis (FEA) and the industry‑leading Ansys® software suite to develop thermal and structural models, evaluating the performance of heaters and components prior to prototyping. With these advanced tools, optimal performance can be achieved with fewer manufacturing iterations. |
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When application conditions exceed the process parameters of the Fullchance Industrial Co.,limited cast‑in method, Fullchance provides an interference fit construction (IFC) using Aluminum 6061. For applications beyond the temperature limits of aluminum materials, alternative base materials such as stainless steel, Inconel, and copper are available. In addition, electron‑beam welded joints can meet compatibility requirements for high‑vacuum applications. |
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Our company specializes in manufacturing highly advanced wafer heaters, which can integrate functions such as cooling tubes and multi‑zone heating to shorten cycle time and optimize temperature management. In addition, susceptor heaters can be equipped with RTD sensors to facilitate seamless integration with control packages. |
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Our wafer heating plate integrates an electrostatic adsorption layer, an intermediate high‑temperature heating core, and a bottom cooling structure composed of a 6061 aluminum substrate, a heat‑insulating plate, and dual‑layer air‑cooled/water‑cooled plates. |
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To meet the traceability requirements of the semiconductor market, St. Berlin offers serialization engraving options for all semiconductor products within its cast‑aluminum solutions. Meanwhile, we strictly follow the documentation procedures specified by customers and implement precise replication control, which has become a core principle in our operating procedures. |
Leading equipment manufacturers trust Fullchance for specialized components because we can address their complex process
challenges. To this end,
we have set up a dedicated new product development team. Supported by our large in‑house R&D laboratory, we take full ownership
of custom
component development throughout the entire journey from concept and prototyping to production.
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The new product development team at Fullchance provides engineering tools and manufacturing resources dedicated to modeling, manufacturing, and testing new products and custom‑designed prototypes.
• Engineering and laboratory technologies include structural and thermal modeling using Finite Element Analysis (FEA), X‑ray and ultrasonic inspection techniques, helium leak testing, 3D CAD software, accelerated lifecycle testing, and infrared thermal imaging in environmental and vacuum chambers.
• Examples: heated nozzles for gas distribution, heating chamber liners and lids, edge‑to‑edge heaters, clean‑room air heaters, valve cylinder heaters, special in‑line liquid/gas heaters, custom‑geometry heating platens, and custom cold plates for wafer cooling stations.
• Available materials include Aluminum 356, Aluminum 6061, stainless steel, bronze, oxygen‑free copper, etc.
• Manufacturing technologies include casting, IFC (electron‑beam welded structures and vacuum brazing).
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This chamber cover is designed by our company's new product development team. The main board is equipped with a precision‑formed interference‑fit cable heater to achieve uniform heat distribution, with two temperature sensors integrated. In terms of electrical interfaces, the power supply and control accessories are elaborately designed to facilitate seamless integration with the customer's existing control panel. |
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This heated gas distribution nozzle is a prime example of our company's in‑house precision manufacturing capabilities. The device is equipped with a 500‑watt tubular heater around its circumference, with hundreds of tiny distribution holes uniformly machined on its surface. The matching precision‑fitting backplate is also manufactured by our company. |
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This highly customized wafer heater features a variety of unique functions. The platen material is bronze, which is selected for compatibility with operating temperatures above 450°C. In addition to the multi‑zone heating system, the unit also incorporates integrated cooling tubes and RTD temperature sensors. |
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Our full‑service test laboratory can verify temperature uniformity using surface‑mounted sensors (see here) or infrared cameras (in atmospheric or vacuum chamber test environments). Accelerated life‑cycle and reliability tests are performed with variable‑voltage power supply inputs, elevated operating temperatures, and irregular ramp rates. Advanced data‑logging equipment provides the required documentation. |
Fullchance Industrial Co.,limited offers standard 200 mm and 300 mm heating plates as off‑the‑shelf assemblies, which are ideal for machine trials,
proof‑of‑concept experiments, or use as backup heaters.
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Manufactured using our proprietary pressure casting process with cast‑in heating elements
• Base Material: Aluminum Alloy 356
• Surface Finish: Bare machined aluminum or hard anodized (MIL‑A‑8525, Type III, Class 1) (.05 mm / 0.002 in)
• Deflection / Surface Flatness: < 0.0005 in (0.013 mm)
• Cleaning methods include ultrasonic cleaning and IPA wiping
• 200 mm Size: Diameter: 228.6 mm (9 in), Thickness: 31.75 mm (1.25 in), with 3 lift pin holes
• 300 mm Size: Diameter: 350 mm (13.78”), Thickness: 40 mm (1.575”), with 3 lift pin holes
• 200 mm Power: 1681 W at 208V (2241 W at 240V); J‑type or K‑type thermocouples are available
• 300 mm Power: 3350 W at 208V (xxxxW at 240V); J‑type or K‑type thermocouples are available
• Operating Temperature up to 752°F (400°C)
• Temperature Uniformity of ± 0.3% of setpoint
• Platen delivered as a single unit, ready for installation
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Our standard 200 and 300 mm pressure plates are available with or without hard‑anodized surfaces (MIL‑A‑8525, Type III, Class 1). These pressure plates are also fitted with three 3.2‑mm through lifting pin holes. Our standard cleaning procedure for these units consists of intensive ultrasonic cleaning followed by thorough IPA wiping. |
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Our development plan for the 200 mm and 300 mm replacement chucks includes a full suite of engineering tests — ranging from FEA thermal simulation, Sensarray temperature uniformity testing (see here), to accelerated lifecycle testing. All of these efforts enable these products to deliver the thermal performance and real‑world field reliability for which Fullchance is renowned. |
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To verify compliance with dimensional and deflection requirements, all Saint Berlin products are inspected using the industry‑most advanced Coordinate Measuring Machines (CMM), with micron‑level accuracy. For verifying the compliance of electronic components, every heating element array undergoes a series of ohmic resistance and high‑performance tests. |
Our PUR‑Therm gas delivery heater features a unique cast‑aluminum solution. It is carefully engineered and thoroughly tested
to meet the strictest heating‑purity standards for carrier
gases and process gases in deposition chambers within the semiconductor industry
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PUR‑Therm is designed as a more efficient and precise mechanism for heating carrier gas and chamber process gas (compared to silicone‑jacketed gas line heaters).
• The gas is contained within a 0.25‑inch (6.3‑mm) outer‑diameter, ultra‑high‑purity seamless 316L stainless‑steel flow tube, pre‑fitted with industry‑standard ultra‑high‑purity VCR fittings.
• Third‑party particle testing (for particles ≥0.3 μm and ≥0.1 μm) shows that the PUR‑Therm flow tube meets the ultra‑high‑purity Semi F70 standard.
• The electropolished inner diameter of the flow tube complies with the ultra‑high‑purity Semi F19 standard: average Ra = 2.53 μin (0.064262 μm), maximum Ra = 3.19 μin (0.081026 μm).
• Bend radii of the flow tube follow the Semi E49 guidelines for inert and reactive gases.
• Standard passivation complies with ASTM‑967 specifications.
• Replaceable heating element: 400‑watt / 208‑volt as standard, with other options available.
• Dual‑sensor Type‑K thermocouples are standard (Type‑J available upon request).
• Optional insulating jacket meets the Semi S2 touch‑safety standard.
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Vacuum heating chuck and heating platen (100 C‑700 C+)
450MM Vacuum Heating Suction Cup
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450MM Vacuum Heating Suction Cup |
300mm heating plate
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300mm hot chuck heater
Vacuum brazed 6061 T6 aluminum heater with surface finish of 2‑3 Ra µin
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300 mm compression heating chuck
Innovative manufacturing processes reduce costs
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300mm vacuum heater base
Vacuum heater base for manufacturing 300mm silicon wafers
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200 mm wafer heating plate
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200mm High‑Temperature Heating Chuck
Excellent uniformity, vacuum integrity and temperature stability
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200mm 8" Copper‑Molybdenum (CuMo) Vacuum Heater Chuck
Better uniformity and higher temperature threshold
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150 mm wafer heating plate
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Vacuum Base Heater
Heating Solutions for ALD Vacuum Chamber Heaters
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150mm 6" Stainless Steel Heating Chuck
Surpassing the Limits of Aluminum
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Clamp‑on Coil Heaters
Deliver excellent temperature uniformity at a lower cost
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Platen vacuum or atmosphere
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Vacuum Hot Plate
Suitable for electronic processing of next‑generation displays such as computer monitors and smartphones under vacuum and atmospheric conditions
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Vacuum Hot Plate - 350mm
Vacuum chamber solutions for testing and processing silicon and glass components
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High‑temperature disc heaters
Demand for high‑temperature applications across various industries has driven the development of innovative high‑temperature disc heaters
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Extrusion die heater
Extrusion is a continuous process that can be used to produce a variety of finished or semi‑finished products. Extruders are equipped with various dies
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Vacuum and atmosphere heater chucks and pressure plates for semiconductor wafers and standardmanufacturing processes
High‑temperature mica heating plate mica heater
Industrial processing tools for storage devices, transistors, crystalline silicon, microprocessors, photovoltaic (PV) cells and thin‑film photovoltaic
of temperature. Fullchance continuously innovates and delivers customer‑specific thermal solutions critical to next‑generation equipment and
Aluminum 6061‑T6 heaters are vacuum‑brazed, with an operating temperature up to 450°C, temperature uniformity of +/-1%, and a surface finish
of 2‑3Ra µin. The heaters can be tested for isolation up to
100 m‑ohm at 1000VDC, and for dielectric withstand voltage of 2E+1000 or higher at 1‑3mA.
plates. These heater plates are typically welded with three
mating plugs for compression and feature an external weld along the edge. They can be constructed with grounded internal thermocouples to
enable rapid response to resistive heating elements for ramp‑up
and high‑temperature monitoring. This ensures over‑temperature cut‑offs can be minimized while maintaining the fastest response time for
moderating rapid heating rates.
Advantages of Fullchance Industrial Co.,limited
Standard Manufacturing
Fullchance welcomes
your custom requirements and will designand deliver
parts that meet your demanding specifications.


between two mica plates and can operate at temperatures up to 500°C.
during manufacturing. Final thermal curing enhances rigidity and sets the form.
conventional mica band heaters in applications with limited installation space.
Technical Specifications
| electrical | hot | Other | |||
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Input Voltage
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12V‑690V
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Maximum Temperature
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500°C
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Minimum Size
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15×30mm
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Watt Density
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≤ 15 W/cm²
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Minimum Temperature
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‑150°C
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Maximum Size
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600×1000mm
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| Resistance tolerance | ≤±5% | thickness | 0.5 - 1.0mm | ||
| dielectric | 30KV/mm | ||||
| temperature sensor | RTD/PT100, thermistor/NTC, thermocouple, thermal fuse, thermal switch | ||||
| Install | RTV, mechanical clamping (metal sheath is optional but not required) | ||||
| Circuit Design | Dual‑input voltage, three‑phase heater, low‑inductance design, etc. | ||||
| lead wire | Teflon, silicone rubber and fiberglass insulated cables, special wire harnesses are available |
Application



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