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It is extremely difficult to achieve cost‑effective heating and cooling for 300 mm wafers under contamination‑free conditions. Fullchance has developed 300 mm wafer pre‑heating and post‑cooling stations that deliver excellent temperature uniformity, rapid heating and cooling, as well as industry‑leading backside contamination performance.
Our cost‑effective modules adopt reliable resistive heating elements, achieving uniformity better than 2 °C and heating up to 450 °C within 15 seconds.
Featuring extremely low backside metallic and particle contamination, this module is critical for 300 mm wafer production.
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An optional cooling plate can be integrated within the same footprint to deliver a highly compact and easily connectable unit.
As an option, process gas can be introduced into both the thermal processing chamber and the cold processing chamber.
Wafer pin lift mechanisms are integrated into the hot platen and cold platen to facilitate wafer transfer.
This module can be used as a standalone unit or integrated via a BOLTS‑compliant interface. The standard control interface can be Ethernet or serial, and can also be customized to meet your requirements.
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Contact us to learn more about heating systems & cooling solutions
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Technical Details
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Applicability
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Temperature uniformity across a 300 mm wafer: < 2°C up to 450°C
Heating: 25°C to 450°C within 15 seconds
Cooling: 400°C to 50°C within < 26 seconds
Wafer repeatability between each pin up‑down cycle: < 70 µm
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Modular design enables quick troubleshooting and low‑cost FRUs.
All components are accessible from the front (for bolt‑on configurations).
The system requires no maintenance other than regular cleaning.
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Cleanliness
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Regulatory Compliance
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Frontside: < 1 @ 0.1 µm, PWP
Backside: < 1,400 @ 0.2 µm, PWP
Metals: Ca, Cr, Fe, K, Mn, Na, Ni, Pb, Zn, Cu, Co, Mo, Ti, W and Al < 1E10/cm
Metals: Fe < 5E09/cm²
Airborne: No degradation to ISO Class 2 environment
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All custom‑designed units comply with SEMI S2/S8, CE and local jurisdiction requirements |
| reliability | interface,facilities |
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The SEMI manufacturing plant has 10 on‑site tools.
Wafer breakage worthy of production processing: < 10,000 wafers
MTBF: > 20,000 hours
Mean Time To Repair: < 2 hours
Uptime: 98%
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Standard hardware BOLTS interface.
Custom hardware interfaces are available.
Communication: Ethernet or serial (custom interfaces provided)
Communication protocols and command sets can be defined to meet customer requirements
Power: 208VAC, 20A
Coolant: 20°C @ > 1.7 GPM, 60 PSIG
Vacuum: 17 in‑Hg min @ 1.5 SCFM
CDA: 60‑90 PSIG, 1 SCFM
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customer service1 