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Background
A semiconductor equipment company in the atomic layer deposition (ALD) market contacted Fullchance for a custom high‑temperature heater solution. Their application involves thin‑film deposition using a range of different chemical processes. Repeating these processes results in the slow deposition of thin films.
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Requirements
• Temperature <700°C
• Internal components must withstand temperatures above 700°C
• Thermal break between flange and base reduces heat transfer in the flange area
• 300‑series stainless steel base, sleeve and flange must meet all required vacuum specifications
• 240 V, 1450 W
• Type "K" thermocouple built into internal components, grounded via radio‑frequency shielding
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Results
Fullchance has produced a high‑efficiency high‑temperature heater with excellent uniformity. This design enables full compression of internal components to achieve optimal heat transfer. The welds around the periphery of the baseplate and the (3) lifting pin hole supports are critical to the design for vacuum integrity, heating‑up rate and temperature stability.
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customer service1 