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An Excellent Choice for the Semiconductor Industry
The clamp‑on coil heater delivers outstanding temperature uniformity of +/-1.5°C at 350°C (refer to the ramp temperature‑versus‑time graph for further details). The current 200 mm form‑factor unit, designed by Saint Berlin, is used for semiconductor wafers to uniformly process 2‑μm dielectric layers on 150 mm and 200 mm silicon substrates. Wafers of both sizes are placed directly onto the hard, clear anodized surface. The 2‑μm dielectric layer on the silicon wafer shows no signs of patterning, a common issue seen with other heater chucks. Furthermore, this is achieved without brazing or casting, lowering prototype costs and lead times.
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Features
• Available in a wide range of shapes and sizes.
• Built‑in heater technology eliminates brazing/casting requirements.
• Suitable for high‑purity applications.
• Precise control and uniformity achieved via custom power density and patterns.
• Distributed power delivers ideal heat application to parts with minimal losses.
• Multi‑zone heating capability enables finer control.
• Compatible with nearly any voltage, AC or DC.
• Integrated sensors including thermocouples and RTDs.
• Multiple lead configurations meet shock‑vibration, vacuum and purity standards
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