Thermal Control
As semiconductor designs shrink, precise thermal control becomes critical in manufacturing. Especially in front‑end processes, thermal management
has a significant impact on throughput. For the popular 300‑mm wafer size, uniform heating across all chips is essential to achieve optimal yield.
emperature variations within a wafer can lead to yield loss. Semiconductor manufacturing involves multiple equipment stages, where wafers are handled
by electrostatic chucks. These chucks use static electricity to firmly hold wafers without causing damage, and modern versions feature integrated heaters.
This enables accurate temperature regulation to compensate for variations in plasma density and cooling‑gas distribution across the wafer surface.
Electrostatic chuck with built‑in heater
proposal
advantages
has a significant impact on throughput. For the popular 300‑mm wafer size, uniform heating across all chips is essential to achieve optimal yield.
emperature variations within a wafer can lead to yield loss. Semiconductor manufacturing involves multiple equipment stages, where wafers are handled
by electrostatic chucks. These chucks use static electricity to firmly hold wafers without causing damage, and modern versions feature integrated heaters.
This enables accurate temperature regulation to compensate for variations in plasma density and cooling‑gas distribution across the wafer surface.
Electrostatic chuck with built‑in heater
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What is an electrostatic chuck?
An electrostatic chuck is a device that uses electric force to hold objects in place. Its advantages include the ability to operate in a vacuum environment and to secure objects such as wafers without causing damage. For this reason, electrostatic chucks are widely used in the manufacturing processes of ultra‑precision equipment such as semiconductor manufacturing facilities.
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Challenges for Electrostatic Chucks with Integrated Heaters
Effective heater design is critical for uniform heating of semiconductor wafers, especially large‑size wafers exceeding 300 mm. As the heating capacity of the metal foils used in heaters increases, more complex design of the foil’s cross‑sectional dimensions and routing is required to raise its resistance and generate the desired amount of heat. In addition, modifications are necessary because thermal performance depends not only on heater design but also on the ceramic plate where the heater is mounted.
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proposal
| Fullchance offers etched metal heaters. |
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advantages
Fullchance offers small‑batch and multi‑variety products to meet customers’ demands for a large number of small‑scale designs, with timely support
• Supports wafers up to 450 mm
• Fullchance performs etching treatment on polyimide (PI)‑coated copper foils
• Fullchance has a reliable quality system to inspect all products shipped to customers
Specification Sheet
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Product Overview of Electrostatic Chuck Heater
Maximum Processing Size: 500mm
Minimum Processing Width: 30μm
Metal Thickness Exceeding 50μm
Etching only for copper foil processing and materials with attached insulators such as PI (Polyimide)
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The precision of micro‑machining is ±20% of the plate thickness.
The precision of the etching process is within ±20% of the plate thickness, with no burrs or particles. In addition, the etching process does not require expensive dies, so the cost remains very low even after multiple trial and verification cuts.
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| Value ② | |
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Support for Large Heaters
Given that UPT can handle etching with a maximum size of 600mm x 900mm, we can also supply heaters for 450mm wafer applications. We have extensive experience and high production capacity in 300mm wafer applications.
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| Value ③ | |
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World‑class Inspection System
The introduction of image‑inspection equipment equipped with artificial intelligence technology mainly started at mass‑production factories. This system’s capability to detect defective products is continuously improving. We are building a comprehensive quality system by boosting inspection output and quality.
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Specification Sheet
Target Metal Type: Copper
Target Metal Thickness: 50μm～
Machining Accuracy: Etching machining accuracy: <20% (relative to metal thickness), applicable to single‑sided etching
Surface Treatment: Supply bare copper sheets for the etching process or copper sheets insulated with materials such as polyimide
customer service1 