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Product Description
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Specification:
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Ceramic Components for Metal and Dielectric‑Film Deposition
Chamber Lids & Liners • Pedestal Heaters • Electroplating Insulators • Deposition Rings • Vacuum Break Filters
Plate‑Type Heaters for Semiconductor Deposition
Semiconductor Deposition Processing
Semiconductor deposition processes utilize volatile precursor gases, plasma and high temperatures to deposit high‑quality thin‑film layers onto wafers. Deposition chambers and wafer‑handling equipment require robust ceramic components to withstand these harsh operating environments.
Fullchance delivers custom‑engineered OEM components for:
- Chemical Vapor Deposition (CVD)
- Physical Vapor Deposition (PVD)
- Electrochemical Plating / Electrochemical Deposition (ECP, ECD)
- Atomic Layer Deposition (ALD)
Deposition Chamber Components
Engineered ceramics offer inertness and durability wherever process hardware is subjected to aggressive deposition conditions or comes into contact with wafers.
- Chamber Lids (Domes)
- Chamber Liners
- Deposition Rings
- Gas Distribution Plates (Showerheads)
- Pedestal Heaters
- Electroplating Insulators
- Vacuum Break Filters
Recommended Materials for Deposition Chamber Components
Sanberlin maintains a broad portfolio of semiconductor‑grade ceramics, including:
- Alumina (Al₂O₃): PlasmaPure™, Sapphal™ and other high‑purity grades
- Aluminum Nitride (AlN)
- PureSiC® Silicon Carbide (SiC)
- Coatings: CVD SiC, ESD‑Safe, Yttria
Alumina Chamber Liners
Chamber Domes and Liners
Chamber domes (also known as lids) establish a clean, inert and protected environment inside deposition chambers. Chemical reactions inside the chamber deposit thin layers of metal, dielectric or semiconductor materials onto wafers.
Chamber lids and liners are exposed to plasma during deposition or etching processes, calling for high plasma resistance, superior purity and dielectric strength. High‑purity alumina (Al₂O₃) and aluminum nitride (AlN) are widely adopted to address these equipment challenges.
Alumina Deposition Rings
Deposition Rings
Deposition rings cover the edge and perimeter of wafers, protecting critical chamber components and extending service life. Directly exposed to deposition processes, they require outstanding plasma durability and high purity, which are essential for final wafer yield.
Plate‑Type Heaters for Semiconductor Deposition
Heating Plates
Heaters for deposition equipment must provide uniform thermal distribution across the entire wafer, alongside high purity and plasma resistance. Sanberlin heaters are custom‑built to meet OEM specifications for wafer diameters up to 300 mm. Aluminum Nitride (AlN) is commonly selected for such heaters thanks to its unique combination of high thermal conductivity and excellent electrical resistance.
Alumina Electroplating Insulators
Electroplating Insulators
Ceramic electroplating insulators are applied in Electrochemical Plating (ECP) and Electrochemical Deposition (ECD) processes, delivering excellent electrical performance and chemical resistance.
Vacuum Break Filter Assemblies
Vacuum Break Filters
Vacuum break filters serve as diffusers for deposition and other vacuum processes, enabling fast, clean venting of vacuum chambers:
1.Reduce particle contamination on wafers to improve yield
2.Accelerate chamber venting for higher throughput
3.Sanberlin vacuum break filters are fabricated from porous alumina (Al₂O₃) and porous silicon carbide (SiC) ceramics, engineered for vacuum chambers of various configurations and dimensions:
4.Tube‑type (for load‑lock, transfer and processing chambers)
5.Disc‑type (for compact‑envelope chambers)
6.Quartz‑type (for thermal‑treatment and LPCVD chambers)
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